Overview
CTI is certified to ISO/IEC for MC CQM tests (MasterCard Card Quality Management) and CSI testing (Card Structure and Integrity Program) for Alternative Materials. These set the specifications and methods required for both conventional and alternative or new technologies to enable manufacturing facilities to gain MasterCard approval. Most of the almost 100 card tests within the MasterCard documents reference the ISO/IEC, ANSI, and EMVCo standards. Both MC CQM/CSI specific and referenced tests can be tested by CTI, with turnaround time dependent on the number of technologies and material types included on the card product. CTI has been recognised by both MasterCard and MC CQM auditors for testing their products for almost 20 years and continues to offer services to manufacturers and card issuers alike.
Please
contact us for a copy of our
Test Timeline Flowchart for further information.
CQM IC Test Methods
|
Test Method |
|
IC Dimensions |
|
Passivation Layer Integrity |
|
IC Backside Roughness |
|
IC Visual Aspects |
|
Die Flex Stress Test |
|
X-Rays |
|
Static Magnetic Fields |
|
Electrostatic Discharges (ESD) |
|
Latch-Up |
|
Contact Pads Maximum Input Voltage Ratings |
|
VCC Contact |
|
CLK Contact |
|
I/O Contact |
|
RST Contact |
|
Parametric Electrical Characteristics - Test Methods using ATE (Contact) |
|
ESD at Antenna Pads |
|
Alternating Magnetic Fields |
|
Operational Carrier Frequency |
|
Operational Carrier Amplitude |
|
Influence of the PICC on the Operating Field |
|
PICC Requirements for Power Transfer PCD to PICC |
|
Power-off Time |
|
Power-on Time |
|
Modulation PCD to PICC – Type A/B (PICC Reception) |
|
Measurement of Load Modulation Characteristics (PICC Transmission) |
|
Temperature and Humidity Exposure |
|
Temperature Cycling |
CQM Personalisation of ID-1 Test Methods
|
Test Method |
|
Durability of Tipping |
|
Embossed Character Relief Height Retention:Pressure |
|
Embossed Character Relief Height Retention: Heat |
|
Durability of Surface Printing, Indent Printing, Thermal Transfer, Laser Engraving, and Drop-on- Demand – Sandpaper Rub Test |
|
Durability of Surface Printing, Indent Printing, Thermal Transfer, Laser Engraving, and Drop-on- Demand – Soft Eraser Rub Test |
|
Durability of Surface Printing, Indent Printing, Thermal Transfer, Laser Engraving, and Drop-on- Demand – Tape Pull Test |
|
Mechanical Reliability: Absence of Residual Stress |
|
Integrity of Character Reproduction |
CQM ID-1 Test Methods
|
Test Method |
|
Card Edge |
|
Card Reference Position |
|
ICM-Edge |
|
Pantone-Colors |
|
Metallic Colors |
|
Registration and Positioning |
|
Printing Aspect |
|
Card Aspect |
|
UV-Printing |
|
Printed Security Elements |
|
Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) - Adhesion, |
|
Aspect and Shape, Size and Positioning |
|
Relative Height of Contacts |
|
Dimension and Location of Contacts |
|
Width and Height |
|
Card Thickness outside Contacts, Embossed Areas and Add-on Areas |
|
Thickness with Add-on Areas |
|
Corners |
|
Card Edges |
|
Bending Stiffness |
|
Durability – Dimensional Stability with Temperature and Humidity |
|
Exposure to Temperature and Humidity |
|
Overall Card Warpage |
|
Resistance to Heat |
|
Peel Strength Test |
|
Advanced Peel Strength Test |
|
Adhesion or Blocking |
|
Dynamic Bending Stress |
|
Dynamic Torsional Stress |
|
Impact Resistance |
|
Corner Impact Test |
|
Surface Abrasion Resistance |
|
Resistance to Chemicals |
|
Opacity |
|
3 Wheel Test |
|
Mechanical Reliability: Wrapping Test |
|
Solidity- ICM Adhesion - Back of Card Spot Pressure Test |
|
ESC - ESD Conductivity of Card |
|
ESC - ESD Conductivity of Materials |
CSI Test Applicable To All Cards
|
Test Method |
|
Width and Height |
|
Card Thickness outside Contacts, Embossed Areas and Add-on Areas |
|
Thickness with Add-on Areas |
|
Corners |
|
Card Edges |
|
Bending Stiffness |
|
Durability – Dimensional Stability with Temperature and Humidity |
|
Exposure to Temperature and Humidity |
|
Overall Card Warpage |
|
Resistance to Heat |
|
Peel Strength Test |
|
Adhesion or Blocking |
|
Dynamic Bending Stress |
|
Dynamic Torsional Stress |
|
Impact Resistance |
|
Corner Impact Test |
|
Surface Abrasion Resistance |
|
Toxicity |
|
Resistance to Chemicals |
|
UV Light |
|
Opacity |
|
Delamination cross-hatch |
|
Hologram |
|
Signature Panel |
|
Static Bending |
CSI - Embossing Specific Tests
|
Test Method |
|
Embossed Character Relief Height Retention: Pressure |
|
Embossed Character Relief Height Retention: Heat |
CSI Tests Applicable To IC Cards
|
Test Method |
|
Relative Height of Contacts |
|
Dimension and Location of Contacts |
|
3 Wheel Test |
|
Mechanical Reliability: Wrapping Test |
|
Solidity- ICM Adhesion |
|
Resistance to Plasticizer |
|
Salt mist |
|
Resistance to chemicals - one-minute tests |
|
Resistance to chemicals - 24-hour tests |
|
Flammability |
|
Temperature Cycling |
|
Temperature and Humidity |
|
Vibration |
|
Delamination - Cross-hatch tape test |
CSI Magnetic Stripe Specific Tests
|
Test Method |
|
Location of Magnetic Stripe |
|
Magnetic Stripe Area Warpage |
|
Magnetic Stripe Surface Distortions |
|
Solidity/Adhesion of Stripe to card |
|
Resistance to Abrasion |
|
Wear test of Magnetic Stripe from Read/Write Head |
|
Dynamic Characteristics of a HiCo Mag Stripe |
|
Static Characteristics of a HiCo Mag Stripe |
Below is a list of Card Products and Card Technologies that are involved with this Card Testing Service.
Products:
Credit Cards / Debit Cards, Loyalty Cards / Gift Cards, Transport Cards, ID Cards & Driver Licences, Passports / MRTD
Technologies:
Magnetic Stripe, Smart Card / Chip Card, RFID / NFC Contactless, EMV Certification, Powered Card / Display Card, Biometric Card, Embossing & Printing
Contact us for further information, and we would also be happy to provide you with a Quotation.